Extending Design Technology Co-Optimization from Technology Launch to HVM with Calibre Fab Solutions

The modern semiconductor design-to-fabrication process heavily relies on intra-module validation mechanisms aimed at preventing the spread of systematic defects.

These validation mechanisms include DRC sign-off of the physical design, verification of optical proximity correction (OPC), metrology and inspection gauging the process, and physical failure analysis to confirm electrical diagnosis.

However, the traditional approaches are not enough to impede the frequently happening systematic failures tied to complex design process interactions.

So how do you enhance semiconductor validation?

Explore this white paper that presents the methodologies and infrastructure necessary to feed:

• Pre-silicon design data and intelligence forward into the manufacturing process
• Manufacturing information back, post-silicon, to inform the design process